Semiconductor memory with vertical charge-trapping memory cells and fabrication

Outside a memory cell field, bit-line contacts are provided on the top bit lines and additional bit-line contacts are provided on the lower bit lines and are each connected in an electrically conductive way to a metallization layer provided for wiring. The bit-line contacts for the upper bit lines and the additional bit-line contacts for the lower bit lines are formed on opposite sides of the memory cell field and portions of the isolation trenches are present between the additional bit-line contacts.