Gapfill process using a combination of spin-on-glass deposition and chemical vapor deposition techniques

A method of filling a plurality of trenches etched in a substrate. In one embodiment the method includes depositing a layer of spin-on glass material over the substrate and into the plurality of trenches; exposing the layer of spin-on glass material to a solvent; curing the layer of spin-on glass ma...

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Bibliographische Detailangaben
Hauptverfasser: Cui, Zhenjiang, Roberts, Rick J, Cox, Michael S, Zhao, Jun
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A method of filling a plurality of trenches etched in a substrate. In one embodiment the method includes depositing a layer of spin-on glass material over the substrate and into the plurality of trenches; exposing the layer of spin-on glass material to a solvent; curing the layer of spin-on glass material; and depositing a layer of silica glass over the cured spin-on glass layer using a chemical vapor deposition technique.