PLANAR LIGHT ILLUMINATION AND IMAGING (PLIIM) BASED SYSTEM HAVING A LINEAR IMAGE DETECTION CHIP MOUNTING ASSEMBLY WITH MEANS FOR PREVENTING MISALIGNMENT BETWEEN THE FIELD OF VIEW (FOV) OF SAID LINEAR IMAGE DETECTION CHIP AND THE CO-PLANAR LASER ILLUMINATION BEAM (PLIB) PRODUCED BY SAID PLIIM BASED SYSTEM, IN RESPONSE TO THERMAL EXPANSION AND/OR CONTRACTION WITHIN SAID PLIIM BASED SYSTEM

A planar laser illumination and imaging (PLIIM) based system comprising a linear image formation and detection module having (i) an image sensing chip having a plurality of conductive pins establishing electrical interconnections with conductive elements within a chip mounting socket mounted on an e...

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Hauptverfasser: Tsikos, Constantine J, Knowles, C. Harry, Zhu, Xiaoxun, Schnee, Michael D, Au, Ka Man, Wirth, Allan, Good, Timothy A, Jankevics, Andrew, Ghosh, Sankar, Naylor, Charles A, Amundsen, Thomas, Blake, Robert, Svedas, William, Defoney, Shawn, Skypala, Edward, Vatan, Pirooz, Dobbs, Russell Joseph, Kolis, George, Schmidt, Mark S, Yorsz, Jeffery, Giordano, Patrick A, Colavito, Stephen J, Wilz, Sr, David W, Schwartz, Barry E, Kim, Steven Y, Fisher, Dale, Van Tassell, Jon
Format: Patent
Sprache:eng
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Zusammenfassung:A planar laser illumination and imaging (PLIIM) based system comprising a linear image formation and detection module having (i) an image sensing chip having a plurality of conductive pins establishing electrical interconnections with conductive elements within a chip mounting socket mounted on an electronic camera board, and (ii) image forming optics with a field of view. The system also includes a heat-exchanging structure, rigidly connected to the image formation optics, and having (i) a body portion provided with heat exchanging elements, (ii) a plurality of apertures through which the plurality of conductive pins on the image sensing chip pass to establish electrical interconnections with the conductive elements within the chip mounting socket, and (III) a plurality of mechanical elements for releasably engaging the package of the image sensing chip so as to rigidly maintain the image sensing chip in alignment with the image forming optics.