Apparatus and method for measuring semiconductor wafer electrical properties

An apparatus for measuring at least one electrical property of a semiconductor wafer includes a probe including a shaft having at a distal end thereof a conductive tip for electrically communicating with an object area of the semiconductor wafer. The apparatus further includes a device for applying an electrical stimulus between the conductive tip and the object area, and a device for measuring a response of the semiconductor wafer to the electrical stimulus and for determining from the response the at least one electrical property of the object area of the semiconductor wafer. A probe guard is included that surrounds the shaft of the probe adjacent the distal end of the probe. The probe guard avoids electrical communication between the probe and areas outside of the object area of the semiconductor wafer.