Defect analysis sampling control

A defect analysis sampling control system comprising a base setting module, a lot setting module, and a work in process (WIP) prediction module. The base setting module is used for choosing and setting a corresponding sampling rule in accordance with different semiconductor products and the lot setting module is used for choosing and setting a corresponding lot sampling rule in accordance with a product lot. The work in process (WIP) prediction module records all WIP products to provide status and progress of the WIP product. The present invention can be applied to a variety of products so as to control and adjust the sampling rule for all products more conveniently and arrange the sampling rules more flexibly.