Ultra wideband BGA

Ultra wideband BGA

An electronic device packaging assembly that includes a ball grid array and specialized construction to be able to operate from DC up to 50 GHz with minimal parasitic losses. The packaging assembly includes a thin base plate made of a suitable rigid material. Power vias, signal vias and ground vias...

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Hauptverfasser: Hathaway, James A, Crossman, Brian F, Din, Salah
Format: Patent
Sprache:eng
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creator Hathaway, James A
Crossman, Brian F
Din, Salah
description An electronic device packaging assembly that includes a ball grid array and specialized construction to be able to operate from DC up to 50 GHz with minimal parasitic losses. The packaging assembly includes a thin base plate made of a suitable rigid material. Power vias, signal vias and ground vias are formed through the base plate to be coupled to traces, circuit components, and/or the device within the packaging assembly. An impedance matching compensation network provides impedance matching between the device and the signal vias. The ball grid array includes a plurality of solder balls, including ground solder balls, signal solder balls and power solder balls, electrically coupled to the appropriate via extending through the base plate.
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title Ultra wideband BGA
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