Ultra wideband BGA
An electronic device packaging assembly that includes a ball grid array and specialized construction to be able to operate from DC up to 50 GHz with minimal parasitic losses. The packaging assembly includes a thin base plate made of a suitable rigid material. Power vias, signal vias and ground vias...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | An electronic device packaging assembly that includes a ball grid array and specialized construction to be able to operate from DC up to 50 GHz with minimal parasitic losses. The packaging assembly includes a thin base plate made of a suitable rigid material. Power vias, signal vias and ground vias are formed through the base plate to be coupled to traces, circuit components, and/or the device within the packaging assembly. An impedance matching compensation network provides impedance matching between the device and the signal vias. The ball grid array includes a plurality of solder balls, including ground solder balls, signal solder balls and power solder balls, electrically coupled to the appropriate via extending through the base plate. |
|---|