Selective area solder placement
A printed circuit board having at least one layer of conductive traces on an external surface has at least one preformed solder element placed on a conductive trace area of the printed circuit board requiring a greater than standard amount of solder. The at least one preformed solder element is refl...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A printed circuit board having at least one layer of conductive traces on an external surface has at least one preformed solder element placed on a conductive trace area of the printed circuit board requiring a greater than standard amount of solder. The at least one preformed solder element is reflowed to form a connection with the layer of printed solder. |
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