Wafer scribing method and wafer scribing device

The present invention relates to a scribing method for wafers, wherein a defined beam is directed onto the wafer by means of a beam generator means so as to remove some wafer material from a wafer region. The invention also relates to a wafer-scribing device including a wafer mount and a beam generator means by means of which at least one defined beam can be directed onto the wafer.The inventive method is distinguished by the by the further step of generating a first radiation pulse having a predeterminable energy density and used to create a comparatively deep pit in the wafer.The inventive wafer scribing means is distinguished by the provision that a radiation pulse can be generated by means of which a comparatively deep pit can be created in the wafer.