Structure comprising an interlayer of palladium and/or platinum and method for fabrication thereof

Structure comprising an interlayer of palladium and/or platinum and method for fabrication thereof

An interconnection structure comprising a substrate having a dielectric layer with a via opening therein; a barrier layer located in the via opening; an interlayer of palladium and/or platinum on the barrier layer; and a layer of copper or copper alloy on the interlayer is provided.

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Bibliographische Detailangaben
Hauptverfasser: Andricacos, Panayotis C, Boettcher, Steven H, McFeely, Fenton Read, Paunovic, Milan
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
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Beschreibung
Zusammenfassung:An interconnection structure comprising a substrate having a dielectric layer with a via opening therein; a barrier layer located in the via opening; an interlayer of palladium and/or platinum on the barrier layer; and a layer of copper or copper alloy on the interlayer is provided.