Strained channel on insulator device

A semiconductor device includes a substrate (e.g., a silicon substrate) with an insulating layer (e.g., an oxide such as silicon dioxide) disposed thereon. A first semiconducting material layer (e.g., SiGe) is disposed on the insulating layer and a second semiconducting material layer (e.g., Si) is...

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Bibliographische Detailangaben
Hauptverfasser: Ge, Chung-Hu, Wang, Chao-Hsuing, Huang, Chien-Chao, Lee, Wen-Chin, Hu, Chenming
Format: Patent
Sprache:eng
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Zusammenfassung:A semiconductor device includes a substrate (e.g., a silicon substrate) with an insulating layer (e.g., an oxide such as silicon dioxide) disposed thereon. A first semiconducting material layer (e.g., SiGe) is disposed on the insulating layer and a second semiconducting material layer (e.g., Si) is disposed on the first semiconducting material layer . The first and second semiconducting material layers and preferably have different lattice constants such that the first semiconducting material layer is compressive and the second semiconducting material layer is tensile