Modular optoelectronic connector

To resolve the problems of the manufacturing costs of an optoelectronic connector, an optoelectronic coupling integrated circuit chip is mounted directly into a package of the connector. This package has an internal shielding metallization and metallizations connected by microconnection techniques to pads of the integrated circuit. The integrated circuit has laser diodes on its surface also connected to the pads of this integrated circuit. These laser diodes are spaced out with respect to one another by a distance corresponding to a distance between the optical fiber terminations in a standardized optical connector. The number of elements of the connector is reduced whereas, at the same time, its efficiency in terms of electrical consumption and in terms of transmission quality of a signal is improved.