Method of attaching a die to a substrate
A semiconductor device includes a base carrier , an adhesive material layer and an integrated circuit die . The base carrier has a top side and a bottom side, the top side having a central area for receiving the die and a peripheral area surrounding the central area. The adhesive material layer is d...
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Sprache: | eng |
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Zusammenfassung: | A semiconductor device includes a base carrier , an adhesive material layer and an integrated circuit die . The base carrier has a top side and a bottom side, the top side having a central area for receiving the die and a peripheral area surrounding the central area. The adhesive material layer is disposed on the top side of the base carrier in an "X" shaped pattern. The "X" shaped pattern includes two bisecting lines. The two bisecting lines extend well beyond the central area and into the peripheral area of the base carrier top surface. The die is attached to the base carrier with the adhesive material layer at the central area. Even after attachment of the die , the adhesive material extends well beyond the die and the central area into the peripheral area. |
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