Developing apparatus and developing method
A substrate (SW) is rotatably held in an approximately horizontal position by a wafer holding and rotation mechanism. One end of a rinsing liquid supply nozzle is rotatably supported by a rinsing liquid supply nozzle rotation supporting mechanism to pass over the substrate (SW). In response to rotat...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A substrate (SW) is rotatably held in an approximately horizontal position by a wafer holding and rotation mechanism. One end of a rinsing liquid supply nozzle is rotatably supported by a rinsing liquid supply nozzle rotation supporting mechanism to pass over the substrate (SW). In response to rotation of the rinsing liquid supply nozzle, the rotation axis of the rinsing liquid supply nozzle moves in a direction closer to or away from the rotation axis of the substrate (SW), whereby the amount of projection of a tip portion of the rinsing liquid supply nozzle is reduced. |
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