Chemical mechanical polishing a substrate having a filler layer and a stop layer
A substrate is chemical mechanical polished with a high-selectivity slurry until the stop layer is at least partially exposed, and then the substrate is polished with a low-selectivity slurry until the stop layer is completely exposed.
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A substrate is chemical mechanical polished with a high-selectivity slurry until the stop layer is at least partially exposed, and then the substrate is polished with a low-selectivity slurry until the stop layer is completely exposed. |
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