Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

The invention relates to a ball-limiting metallurgy stack for an electrical device that contains at least one copper layer disposed upon a Ti adhesion metal layer. The ball-limiting metallurgy stack resists Sn migration toward the upper metallization of the device.

Bibliographische Detailangaben

Hauptverfasser:	Datta, Madhav, Emory, Dave, Joshi, Subhash M, Menezes, Susanne, Suh, Doowon
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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