Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
The invention relates to a ball-limiting metallurgy stack for an electrical device that contains at least one copper layer disposed upon a Ti adhesion metal layer. The ball-limiting metallurgy stack resists Sn migration toward the upper metallization of the device.
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The invention relates to a ball-limiting metallurgy stack for an electrical device that contains at least one copper layer disposed upon a Ti adhesion metal layer. The ball-limiting metallurgy stack resists Sn migration toward the upper metallization of the device. |
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