Electronic component handling apparatus and electronic component handling method
An electronic-component handling apparatus includes a) an electronic-component retainer provided with an adhesive layer for retaining multiple electronic components by an adhesion force at the bottom surface thereof and b) a blade which is used for removing the electronic components from the adhesiv...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | An electronic-component handling apparatus includes a) an electronic-component retainer provided with an adhesive layer for retaining multiple electronic components by an adhesion force at the bottom surface thereof and b) a blade which is used for removing the electronic components from the adhesive layer. A driving mechanism moves the blade relative to the adhesive layer along the surface of the adhesive layer while forming a dent in the bottom surface of the adhesive layer by a tip of the blade. |
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