Fan-less housing

In a heat dissipating internally fan-less housing for electronic circuits and components, the housing has an assembly of two container parts comprising heat-sink fins. Each part has a substantially diagonal shaped profile. In the housing, a circuit-board is mounted along the diagonal profile thus pr...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Elo, Anders, Eriksson, Jörgen, Sonesson, Niclas
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:In a heat dissipating internally fan-less housing for electronic circuits and components, the housing has an assembly of two container parts comprising heat-sink fins. Each part has a substantially diagonal shaped profile. In the housing, a circuit-board is mounted along the diagonal profile thus providing that the long-side ends of the circuit-board on each side of the board are covered by a greater mass of heat-sink fins compared to a horizontally mounted circuit board for a better cooling of components.