Method for forming a passivation layer for air gap formation

a, bab ab ab abDummy features are formed within an interlevel dielectric layer. Passivation layers (and ) are formed by electroless deposition to protect the underlying conductive regions (and ) from being penetrated from the air gaps. In addition, the passivation layers (and ) overhang the underlying conductive regions (and ), thereby defining dummy features (and ) adjacent the conductive regions (and ). The passivation layers (and ) can be formed without additional patterning steps and help minimize misaligned vias from puncturing air gaps.