Flexible printed wiring board
The present invention relates to a flexible printed board comprising a copper foil and a polyimide resin layer formed thereon, with excellent adhesive strength between the copper foil and the polyimide resin layer, good flatness, and suitable for the implementation of fine wiring patterns. A flexibl...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The present invention relates to a flexible printed board comprising a copper foil and a polyimide resin layer formed thereon, with excellent adhesive strength between the copper foil and the polyimide resin layer, good flatness, and suitable for the implementation of fine wiring patterns.
A flexible printed board contains an unroughened electrodeposited copper foil, a zinc-based metallic layer provided thereon in an amount of 0.25 to 0.40 mg/dm, and a polyimide resin layer formed through the imidation of a polyamic acid layer provided on the zinc-based metallic layer. |
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