Conductive resin composition and contact board using the same
1. Field of the Invention The conductive resin composition contains silver powder that is a mixture of spherical particles and dendrite particles dispersed in binder resin, wherein the content (% by volume) of the spherical particle is larger than the content of the dendrite particle so that a condu...
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| creator | Matsumora, Satoru |
| description | 1. Field of the Invention
The conductive resin composition contains silver powder that is a mixture of spherical particles and dendrite particles dispersed in binder resin, wherein the content (% by volume) of the spherical particle is larger than the content of the dendrite particle so that a conductive path is formed by silver powder of spherical particles, and dendrite particles are interposed between spherical particles. |
| format | Patent |
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The conductive resin composition contains silver powder that is a mixture of spherical particles and dendrite particles dispersed in binder resin, wherein the content (% by volume) of the spherical particle is larger than the content of the dendrite particle so that a conductive path is formed by silver powder of spherical particles, and dendrite particles are interposed between spherical particles.</description><language>eng</language><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6833181$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,778,800,883,64020</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6833181$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Matsumora, Satoru</creatorcontrib><creatorcontrib>ALPS Electric Co., Ltd</creatorcontrib><title>Conductive resin composition and contact board using the same</title><description>1. Field of the Invention
The conductive resin composition contains silver powder that is a mixture of spherical particles and dendrite particles dispersed in binder resin, wherein the content (% by volume) of the spherical particle is larger than the content of the dendrite particle so that a conductive path is formed by silver powder of spherical particles, and dendrite particles are interposed between spherical particles.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2004</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZLB1zs9LKU0uySxLVShKLc7MU0jOzy3IL84syczPU0jMSwHy80oSk0sUkvITi1IUSoFK0hVKMlIVihNzU3kYWNMSc4pTeaE0N4OCm2uIs4duaXFBYklqXklxfHpRIogyMLMwNja0MDQmQgkAA60xKw</recordid><startdate>20041221</startdate><enddate>20041221</enddate><creator>Matsumora, Satoru</creator><scope>EFH</scope></search><sort><creationdate>20041221</creationdate><title>Conductive resin composition and contact board using the same</title><author>Matsumora, Satoru</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_068331813</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2004</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Matsumora, Satoru</creatorcontrib><creatorcontrib>ALPS Electric Co., Ltd</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Matsumora, Satoru</au><aucorp>ALPS Electric Co., Ltd</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Conductive resin composition and contact board using the same</title><date>2004-12-21</date><risdate>2004</risdate><abstract>1. Field of the Invention
The conductive resin composition contains silver powder that is a mixture of spherical particles and dendrite particles dispersed in binder resin, wherein the content (% by volume) of the spherical particle is larger than the content of the dendrite particle so that a conductive path is formed by silver powder of spherical particles, and dendrite particles are interposed between spherical particles.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
| recordid | cdi_uspatents_grants_06833181 |
| source | USPTO Issued Patents |
| title | Conductive resin composition and contact board using the same |
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