Conductive resin composition and contact board using the same
1. Field of the Invention The conductive resin composition contains silver powder that is a mixture of spherical particles and dendrite particles dispersed in binder resin, wherein the content (% by volume) of the spherical particle is larger than the content of the dendrite particle so that a condu...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | 1. Field of the Invention
The conductive resin composition contains silver powder that is a mixture of spherical particles and dendrite particles dispersed in binder resin, wherein the content (% by volume) of the spherical particle is larger than the content of the dendrite particle so that a conductive path is formed by silver powder of spherical particles, and dendrite particles are interposed between spherical particles. |
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