Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
The present invention relates generally to chemical mechanical polishing of substrates, and more particularly to a polishing pad having a grooved pattern for a chemical mechanical polishing apparatus. A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurali...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The present invention relates generally to chemical mechanical polishing of substrates, and more particularly to a polishing pad having a grooved pattern for a chemical mechanical polishing apparatus.
A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of concentric circular grooves. The polishing pad may include multiple regions with grooves of different widths and spacings. |
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