Premolded cavity IC package

The present invention relates in general to integrated circuit packaging, and more particularly to an improved process for fabricating a premolded cavity integrated circuit package that includes a feature to inhibit mold contamination of the inner lead bonding area. A process for fabricating a cavit...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Thamby, Labeeb Sadak, McLellan, Neil, Wong, Hugo Chi Wai, Chow, William Lap Keung
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The present invention relates in general to integrated circuit packaging, and more particularly to an improved process for fabricating a premolded cavity integrated circuit package that includes a feature to inhibit mold contamination of the inner lead bonding area. A process for fabricating a cavity-type integrated circuit package. The process includes: supporting an interior portion of each of a plurality of leads, in a mold; supporting a die attach pad in said mold; molding a package body in said mold such that said leads extend from an interior cavity of said package body to an exterior thereof; mounting a semiconductor die to said die attach pad; wire bonding various ones of said leads to said semiconductor die; adding a fill material for covering at least a surface of said interior portion of said leads; and mounting a lid on said package body for enclosing said die in said cavity of said package body.