Method for forming a micro-pattern on a substrate

The present invention relates to a method for forming a micro-pattern on a substrate; and more, particularly, to a method for forming a micro-pattern on a substrate by employing a compression patterning technique. In a method for forming a micro-pattern on a substrate (), polymer material having a solvent is coated on the substrate, thereby forming a polymer film on the substrate. Then, a mold () having a predetermined shape is compressed into the polymer film () on the substrate by employing a predetermined compression technique to entail a plastic deformation of the polymer film, thereby patterning the polymer film. This compression procedure is performed at a room temperature, e.g., of about 10 to about 30° C. In the present invention, before the mold () is pressed into the polymer film (), a free volume in the polymer film is previously increased so that a pressure applied on the polymer material needed to plastically deform the polymer film is reduced. Thereafter, etching is performed on the substrate through the use of the patterned polymer film as an etching mask, thereby forming a micro-pattern on the substrate.