Cross-midplane switch topology

The present invention relates, in general, to interconnection topologies between circuit boards in a chassis, and more specifically, to an interconnection topology for large arrays of switching modules requiring high speed. A chassis for holding modules including a set of first modules oriented horizontally in the chassis and a set of second modules oriented vertically in the chassis. A midplane is oriented orthogonally to the sets of first and second modules. The midplane has connector pins extending from its first side through its second side. Each of the first modules has a first connector for mating with the connector pins extending from the first side, and each of the second modules has a second connector for mating with the connector pins extending from the second side.