Cleaning member and cylindrical cleaning element

The present invention relates to a cleaning member which is used in, for example, a scrub cleaning process for semiconductor wafers. A rotary shaft having a predetermined diameter and a cylindrical cleaning element having an axial through-hole formed therein and capable of being either in a wet or a dry state are prepared. The through-hole has, in a wet state, a predetermined diameter smaller than that of the rotary shaft. The cleaning element is wetted and the through-hole of the wet cleaning element enlarged so that it has a diameter larger than that of the rotary shaft. The enlarged cleaning element is dry-set and the rotary shaft is inserted into the through-hole of the cleaning element. The cleaning element is then wetted, to contract the diameter of the through-hole of the cleaning element and provide a press-fit between the cleaning element and the shaft. A, cleaning member comprising a cylindrical cleaning element and a rotary shaft held therein with a press-fit is obtained.