EMI and noise shielding for multi-metal layer high frequency integrated circuit processes

This invention relates generally to integrated circuits including integrated circuits with passive components such as inductors or capacitors and integrated circuits with active elements such as transistors. A circuit element that may generate or be affected by noise or electromagnetic interference may be substantially surrounded by one or more encircling plugs. The encircling plug may be closed by an interconnection layer. The plug may be grounded to reduce the electromagnetic interference or noise generated by or coupled to said passive circuit element.