Flip-chip type semiconductor device

This invention relates to flip-chip type semiconductor devices sealed with cured products of epoxy resin compositions of inorganic filler loading type affording the cured products having low stress and high transparency. A flip-chip type semiconductor device sealed with a light transmissive epoxy resin composition comprising(A) an epoxy resin having the following general formula (i): wherein n is 0 or a positive number,(B) a curing accelerator, and(C) an amorphous silica-titania co-melt as at least one of inorganic fillers,said composition satisfying the relationship of the following formula (1): wherein nis the refractive index at 25° C. of the cured product of the composition excluding the inorganic fillers, and nis the refractive index at 25° C. of the inorganic fillers.