Photonic integrated circuit (PIC) and method for making same

The present invention relates generally to Photonic Integrated Circuits (PICs) and methods for making the same. A photonic integrated circuit including: at least one photonic component being suitable for operation with a plurality of photons and including an operational material having a bandgap energy close to the energy of the photons; and, at least one photonic component being suitable for operation with the plurality of photons, including an operational material having a bandgap energy substantially higher than the photons and being adjacent to the at least one photonic component including an operational material having a bandgap energy close to the energy of the photons. The at least one photonic component including an operational material having a bandgap energy substantially higher than the photons includes at least one amorphous silicon based alloy material.