Method for gross input leakage functional test at wafer sort

The invention relates to semiconductor testing, and, more particularly, to a method for wafer sort testing. A method and test configuration for performing a gross input leakage test at wafer sort is described. The method uses a pullup and pulldown on an I/O pad to inject current at the I/O pad, and,...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Mark, David, Simmons, Randy J
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The invention relates to semiconductor testing, and, more particularly, to a method for wafer sort testing. A method and test configuration for performing a gross input leakage test at wafer sort is described. The method uses a pullup and pulldown on an I/O pad to inject current at the I/O pad, and, based on the resulting voltage, determines if the leakage current is excessive. The method allows an input leakage test to be performed at wafer sort without a precision measurement unit and without direct access to the I/O pad to be tested.