Molding material for electrical and electronic parts

The present invention relates to a polyamide resin. More particularly, the invention relates to a polyamide resin which has low water absorption, is excellent in moldability, mechanical strength and heat resistance and is favorably used for electric or electronic parts, a polyamide resin composition using the polyamide resin, and an electric or electronic part comprising the polyamide resin composition. The polyamide resin composition of the invention is characterized by having a solder reflow heat-resistant temperature of not lower than 250° C. Since the polyamdie resin composition has low water absorption and is excellent in moldability, heat resistance, shape stability and mechanical strength, it can be suitably used for, for example, automobile parts and electric or electronic parts.