Silicone rubber adhesive composition and integrally molded article of silicone rubber and thermoplastic resin

This invention relates to a silicone rubber adhesive composition which can be simply and briefly molded by injection molding, extrusion or mechanical application using a robot, is suited for primerless molding and hence, integral molding with a thermoplastic resin, and exhibits the unique nature that when molded together with a thermoplastic resin in a mold which has been or has not been surface treated as by chromium plating, the composition is adherent only to the resin, but not to the mold. It also relates to an integrally molded article of a cured product (silicone rubber) of a silicone rubber adhesive composition bonded to a thermoplastic resin. A silicone rubber adhesive composition comprising (A) a heat curable organopolysiloxane composition of the addition curing type or peroxide curing type, (B) reinforcing silica fines, and (C) an organic compound or organosilicon compound having an epoxy equivalent of 100-5,000 g/mol and containing at least one aromatic ring in a molecule is easily moldable within a short time by injection molding, suitable in primerless molding, and bondable with various thermoplastic resins. Integrally molded articles in which the silicone rubber adhesive composition is firmly bonded to the thermoplastic resin are obtainable without a need for modification of the resin.