Electrostatic chucking system, and apparatus and method of manufacturing a semiconductor device using the electrostatic chucking system
1. Field of the Invention A voltage is applied to an electrode of an electrostatic chuck for chucking a semiconductor substrate, and the application voltage is controlled stepwise by means of a voltage control section. In the electrostatic chucking system, a temperature sensor may be provided for de...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | 1. Field of the Invention
A voltage is applied to an electrode of an electrostatic chuck for chucking a semiconductor substrate, and the application voltage is controlled stepwise by means of a voltage control section. In the electrostatic chucking system, a temperature sensor may be provided for detecting the temperature of the semiconductor substrate held by the electrostatic chuck, wherein a signal output from the temperature sensor is input to the voltage control section to thereby control the applied voltage. |
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