Device for specific particle manipulation and deposition

This application is a divisional of application Ser. No. 09/676,366, filed Sep. 29, 2000, now U.S. Pat. No. 6,616,987 which is a continuation of PCT/EP99/02241, filed Apr. 4, 1999, which claims benefits from German Patent Application No. 198 14 871.2, filed Apr. 2, 1998, incorporated herein by reference. A process for manipulating particles distributed substantially non-uniformly in a plasma of a carrier or reaction gas, wherein Coulomb interaction between the particles is so low that the particles substantially do not form a plasmacrystalline state, and the particles are exposed in a location-selective manner to external adjustment forces and/or the plasma conditions are subjected to a location-selective change to apply at least a portion of the particles onto a substrate surface mask-free and/or subject it to a location-selective plasma treatment in the carrier or reaction gas.