Mounting structure for mounting a resin molded article to a body panel

The present application claims priority under 35 U.S.C. §119 to Japanese Patent Application No. 2000-297206, filed Sep. 28, 2000, entitled "MANUFACTURING METHOD AND MOUNTING STRUCTURE OF SIDE BRAID", Japanese Patent Application No. 2000-300535, filed Sep. 29, 2000, entitled "MOUNTING...

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Bibliographische Detailangaben
Hauptverfasser: Miyano, Tetsuya, Kawashima, Daiichiro, Nishikawa, Tomokazu, Nada, Sadao, Takagi, Moriyoshi, Shibagaki, Toshiro
Format: Patent
Sprache:eng
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Zusammenfassung:The present application claims priority under 35 U.S.C. §119 to Japanese Patent Application No. 2000-297206, filed Sep. 28, 2000, entitled "MANUFACTURING METHOD AND MOUNTING STRUCTURE OF SIDE BRAID", Japanese Patent Application No. 2000-300535, filed Sep. 29, 2000, entitled "MOUNTING STRUCTURE OF CLIP TO RESIN MOLDED ARTICLE" and Japanese Patent Application No. 2001-239683, filed Aug. 7, 2001, entitled "MANUFACTURING METHOD AND MOUNTING STRUCTURE OF SIDE BRAID". The contents of this application are incorporated herein by reference in their entirety. A high-strength mounting structure is used for attaching a resin article to a body panel. The resin molded article has an elongated main body and a pair of mount ribs formed in several spots intermittently in a longitudinal direction. A protrusion is provided at a distal end of each of the mount ribs. A clip has latch claws for engaging the protrusions of the mount ribs, and a slip-proof lug is located opposite to each latch claw to resist release the latch claws from the protrusions. In addition, the clip has an engagement section engaged with a body panel at a side facing the body panel.