Method and system for removing conductive lines during deprocessing
The present invention relates to deprocessing of semiconductor devices and more particularly to a method and system for removing conductive lines, particularly copper lines. A system and method for removing a conductive line from a semiconductor device is disclosed. The conductive line includes a co...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The present invention relates to deprocessing of semiconductor devices and more particularly to a method and system for removing conductive lines, particularly copper lines.
A system and method for removing a conductive line from a semiconductor device is disclosed. The conductive line includes a conductive layer and a barrier layer separating the conductive layer from a portion of the semiconductor device. The method and system include exposing a portion of the barrier layer, etching the barrier layer after the barrier layer has been exposed, and lifting off the conductive layer after the barrier layer has been etched. |
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