Electronic component with stacked electronic elements

The present invention relates to an electronic component with stacked electronic elements and to methods of fabricating electronic components with stacked electronic elements. An electronic component includes stacked electronic elements with external contacts. The external contacts are connected to contact terminal pads of an interconnect layer disposed on an isolating body. This isolating body extends over underlying side edges of a further electronic element, and its interconnect layer is connected to another interconnect layer of the stack via its external contact surfaces.