Reflow soldering apparatus and method for selective infrared heating

The invention is generally directed to a reflow soldering apparatus and method. More particularly, a reflow soldering apparatus and method are provided for selective infrared radiant heating alone or in combination with convection heating for solder mounting electrical and electronic components to surfaces of circuit boards. A reflow soldering apparatus and method are provided for reflow soldering electrical and electronic components to circuit boards. The reflow soldering apparatus and method use selective infrared (IR) heating alone or in combination with convection heating to achieve reflow soldering. Selective IR heating provided by the apparatus and method according to the invention helps to eliminate or helps to at least substantially reduce a risk overheating and thermal damage to non-targeted electrical and electronic components and areas of circuit boards during reflow.