Thermosetting resin composition

The present invention relates to a thermosetting resin composition (or a mixture of such materials) useful for semiconductor encapsulants, printed circuit substrates, automobile parts, etc., a process for producing such a composition, molded articles thereof and their uses. A device allows for continuous regulation of the composition of a fluid mixture that includes at least two components of different polarities. The device is designed, for example, to be inserted in a separation system that the device supplies with a carrier fluid of stabilized composition. The device includes a storage tank () receiving a mixture coming from the separation system and at least one auxiliary vessel () containing one of the components of the mixture. To control the transfer of this component from auxiliary vessel () to storage tank (), the device further includes at least one tubular capacitive sonde (CS) totally immersed in the fluid mixture, a sonde (TS) for measuring the temperature of the mixture, and a sondc (LS) for measuring the mixture level in storage tank (). A regulating unit () is connected to the various sondes to determine the volume of the component to be transferred to storage tank () from the at least one auxiliary vessel in order to restore a set composition for the mixture. The device can be used, for example, for the control of simulated moving beds, of distillation columns, etc.