Semiconductor device and manufacturing method thereof

The present invention relates generally to semiconductor devices and the manufacturing methodology thereof; and, more particularly, the invention relates to technologies usefully applicable to high-density mountable semiconductor devices with tape carrier package (TCP) structures along with fabrication methods thereof. A semiconductor chip is disposed within a device hole as formed in a tape base material of a tape carrier , which chip is smaller in thickness than the tape base material , and then sealing is performed by a seal resin to permit both the principal surface and back surface of such semiconductor chip to be coated therewith. And, the position of the semiconductor chip in a direction along the thickness of the tape base is set to correspond to a stress neutral plane of the TCP as a whole.