Barrier layer for copper metallization in integrated circuit fabrication

This invention is in the field of integrated circuit fabrication, and is more specifically directed to the formation of metal conductor layers in integrated circuits. A barrier layer () for an integrated circuit structure is disclosed. The barrier layer () is a refractory metal silicon compound, such as a refractor metal silicon nitride compound, formed in an amorphous state. The barrier layer () has a relatively low composition ratio of silicon, and of nitrogen if present, to provide low resistivity in combination with the high diffusion barrier properties provided by the amorphous state of the film. A disclosed example of the barrier layer () is a compound of tantalum, silicon, and nitrogen, formed by controlled co-sputtering of tantalum and silicon in a gas atmosphere including nitrogen and argon. The barrier layer () may be used to underlie copper metallization (), or the barrier layer () may be part or all of a lower plate in a ferroelectric memory capacitor ().