Low profile dielectrically loaded meanderline antenna

It is generally known that antenna performance is dependent upon the antenna size, shape, and the material composition of certain antenna elements, as well as the relationship between the wavelength of the received or transmitted signal and certain antenna physical parameters (e.g., length for a lin...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Kralovec, Jay A, Hendler, Jason M
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:It is generally known that antenna performance is dependent upon the antenna size, shape, and the material composition of certain antenna elements, as well as the relationship between the wavelength of the received or transmitted signal and certain antenna physical parameters (e.g., length for a linear antenna and diameter for a loop antenna). These relationships and physical parameters determine several antenna performance characteristics, including input impedance, gain, directivity, polarization and the radiation pattern. Generally, for an operable antenna, the minimum physical antenna dimension (or the minimum effective electrical length) must be on the order of a quarter wavelength (or a multiple thereof) of the operating frequency, which thereby limits the energy dissipated in resistive losses and maximizes the energy transmitted. Quarter wave length and half wave length antennae are the most commonly used. An antenna having a plurality of conductive layers formed on a dielectric substrate. A ground plate and a feed plate are oriented in substantially parallel relation on two opposing sides of the dielectric substrate. A top plate, which is electrically connected to the ground plate and electrically insulated from the feed plate, is disposed on a third surface of the dielectric substrate perpendicular to the first and the second surfaces. One or more conductive layers are also disposed within the interior of the dielectric substrate parallel to the first and the second surfaces. One or more conductive vias extend between the feed plate and the ground plate through the interior of the dielectric substrate. In various embodiments these conductive vias are connected to one or more of the feed plate, the ground plate, and the interior conductive surfaces.