Probe applied to semiconductor package test and method for testing semiconductor package

1. Field of the Invention A probe used for testing on a semiconductor package is provided which is capable of reducing scratching of a solder ball, sticking of solder to a contact terminal, and damage to the contact terminal. A diameter of an end portion of the contact terminal of a probe is set to be almost the same as that of a solder ball. The end portion is provided with a semispherical concave portion to be contacted with the solder ball and a plurality of guiding grooves formed from a center of the concave portion in a direction of a diameter and used to guide solder separated from the solder ball and stuck to the concave portion.