Diamond barrier layer

This invention relates to the field of integrated circuit fabrication. More particularly, this invention relates to a process of forming a composite barrier layer including a diamond film for low-k dielectric interconnects. An integrated circuit including an electrically conductive interconnect havi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Catabay, Wilbur G, Wang, Zhihai
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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