Microwave assisted bonding method and joint

1. Field of the Invention A method of bonding together first and second components and a joint are provided. The method includes the steps of applying a film coating of electrically conductive material to an adjoining interface of a first component surface of the first component and a second component surface of the second component. The film coating has a thickness of less than 200 nanometers. The method also includes the step of positioning the first and second components such that the film coating is disposed between the first and second component surfaces. The method further includes the step of irradiating microwave energy to the film coating to generate thermal energy on the film coating to bond together the first and second components.