Flip-chip system and method of making same

Embodiments of the present invention relate to a packaged semiconductive die with integrated circuitry. More particularly, an embodiment relates to bonding a packaged die to a board with an underfill mixture that includes properties similar to a particulate-filled underfill composite. A system for underfilling in a chip package includes an underfill mixture that ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In one embodiment, the system includes an underfill mixture that alone exhibits a CTE that is characteristic of an inorganic-filled underfill composite previously known. An embodiment is also directed to the assembly of a flip-chip package that uses an underfill mixture.