Plane splits filled with lossy materials
The present invention pertains to the field of printed circuit boards. More particularly, the present invention relates to a method to help provide an improved high frequency current return path through the use of high frequency conductive materials in splits of PCB planes. A method of reducing elec...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The present invention pertains to the field of printed circuit boards. More particularly, the present invention relates to a method to help provide an improved high frequency current return path through the use of high frequency conductive materials in splits of PCB planes.
A method of reducing electromagnetic interference and improving signal quality in printed circuit boards with plane splits is described. The use of a lossy slot filling is described. The lossy filling is applied above plane splits and squeezed into the slots. The lossy material helps to damp antenna resonance. |
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