Test contact mechanism

The present invention relates to semiconductor testing and testing devices. In particular, the present invention relates to a system for establishing contact between a device under test and a test socket. The present invention provides test contact systems and associated integrated circuit device testing systems, and integrated circuit device testing methods that reduce the number of integrated circuit devices that are lost through handler mishap. The invention provides a test contact system in which a contacting force, or a substantial portion thereof, is exert against the substrate of a device under test, rather than exerting the entire force against the die. The invention also provides a system for adjusting the distribution of the contacting force between the substrate and the die. This mechanism allow the force against the die to be kept within a range that provides good thermal contact between the die and the test contact mechanism without damaging the die. The balance of the contacting force can be transmitted to the substrate of the device under test through a resilient member, thereby further reducing the risk of damage to the device under test. The invention further provides a vacuum seal comprising a foam type material to which devices under test do not stick, which substantially eliminates handler jambs resulting from devices under test sticking to the vacuum seal. The test contact systems of the invention, and associated testing systems and methods, significantly reduce the number of integrated circuit devices damaged during testing.